Technical Program Committee
Jingrui An,
Jiangnan University, China
Alessandra Angelucci,
Politecnico di Milano, Italy
Leila Aflatoony,
Georgia Institute of Technology, USA
Giancluca Amprimo,
Politecnico di Torino, Italy
Letizia Bergamasco,
LINKS Foundation, Italy
Luigi Borzì,
Politecnico di Torino, Italy
Kris Cuppens,
Thomas More University of Applied Sciences, Belgium
Florenc Demrozi,
University of Stavanger, Norway
Özlem Durmaz İncel,
University of Twente, the Netherlands
Dimitrios Fotiadis,
University of Ioannina & FORTH, Greece
Yuan Feng,
Northwestern Polytechnical University, China
Fasih Haider,
University of Edinburgh, UK
Yan Hu,
Blekinge Institute of Technology, Sweden
Maarten Houben,
Eindhoven University of Technology, the Netherlands
Haridimos Kondylakis,
University of Crete & FORTH-ICS, Greece
Vitaveska Lanfranchi,
The University of Sheffield, UK
Hadas Lewy,
Holon Institute of Technology, Israel
Cun Li,
Shandong University, China
Boya Li,
Leiden University, the Netherlands
Wei Liu,
University of Macau, China
Beatriz Merino-Barbancho,
Universidad Politécnica de Madrid, Spain
José Manuel Molina,
Carlos III University of Madrid, Spain
Dympna O’Sullivan,
Technological University Dublin, Ireland
Carlos Polvorinos,
Universidad Politecnica de Madrid, Spain
Shi Qiu,
Shanghai Jiao Tong University, China
Stefan Rahr Wagner,
Aarhus University, Denmark
Irene Rechichi,
Politecnico di Torino, Italy
Marc Roper,
University of Strathclyde, UK
Michael Rohs,
University of Hannover, Germany
Dario Salvi,
Malmö University, Sweden
Rosa Lilia Segundo Diaz,
Hasselt University, Belgium
Luis Sigcha,
University of Minho, Portugal
Veronica Sundstedt,
Blekinge Institute of Technology, Sweden
Dipak Surie,
Malmö University, Sweden
Charlotte Tang,
The University of Michigan-Flint, USA
Daniel Tetteroo,
Eindhoven University of Technology, the Netherlands
Paula Toledo,
Universidad Carlos Tercero, Spain
Thanasis Tsanas,
University of Edinburgh, UK
Pieter van Gorp,
Eindhoven University of Technology, the Netherlands
Koen van Turnhout,
HU University of Applied Sciences Utrecht, the Netherlands
Dieff Vital,
University of Illinois Chicago, USA
Konstantinos Votis,
Centre for Research and Technology Hellas, Greece
Katarzyna Wac,
University of Geneva, Switzerland
Gubing Wang,
Tilburg University, the Netherlands
Qi Wang,
Tongji University, China
Mengru Xue,
Zhejiang University, China
Weiwei Zhang,
Beijing University of Post and Telecommunication, China
Samaneh Zolfaghari,
Malardalen University, Sweden

